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深圳市知恒智能科技有限公司

知恒智能科技RFID電子標(biāo)簽自動(dòng)化設(shè)備供應(yīng)商

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RFID Die Bonding Machine

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  • FCB-320 RFID Die Bonding Machine

FCB-320 RFID Die Bonding Machine 類別：RFID Die Bonding Machine

產(chǎn)品簡(jiǎn)介： FCB-320 RFID Die bonding machine confirms the process technology of Lable before mass production. Compared with the traditional machine, it has greatly improved in the counterpoint of chip and antenna, accuracy of temperature control, the testable of heat pr...

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產(chǎn)品介紹

FCB-320 Technology Specifications
   Both vision system, one for die, another for antenna;
   Both display, independent working, imagine suitable;
   Independent heat pressure system, change easily and high accuracy;
   Adopt PLC + temperature module + tough screen, steady temperature control;
   Die dimension can exceed 2mm;
   Operation easily, maintain easily;
   Suitable RFID electronic tags product technology test, making      sample, and small-quantity production;
FCB-320 Technology Specifications
   Machine Dimension：L640mm*W460mm*H600mm;
   Machine Weight and Power：About35kg, 200W;
   Heat Pressure Range：0.55N~2N  ±0.08N;
   Heat Pressure Temperature：50~250 ℃  ±1 ℃;
   Die Dimension: 0.3mm x 0.3mm ~2.5mm x 2.5mm，UF, UHF;
   Die Supply：Tray Plate;
   Product Dimension：Antenna ≤120mm x 100mm;
   Vision System：Two (Upper for antenna, Below for Die) ；
   Control Method and Power Supply：PLC Control, 220VAC;
   Die Bonding Accuracy：±20 um;